WB03A-8684H2V1 Module Specification¶

1. Product description¶

1.1 Product description¶

WB03A-8684H2V1 is a low power consumption embedded (2.4 GHz Wi­Fi) and Bluetooth 5 (LE) IOT dual-mode module. It consists of a highly integrated radio frequency (RF) wireless core, the ESP8684, and the WB03A-8684H2V1. It consists of a highly integrated wireless RF chip, ESP8684, and a small number of peripheral devices, supports STA/AP/STA+AP operation modes, and low-power Bluetooth connectivity at the same time. The WB03A-8684H2V1 includes a 32-bit MCU running at up to 120 MHz, a 1T1R WLAN, 272 KB of SRAM and 2 MB of internal Flash, and a rich set of peripherals. 2MB Flash and rich peripheral resources. The WB03A-8684H2V1 is an RTOS platform with integrated libraries for all Wi-Fi MAC and TCP/IP protocols. Users can develop their own applications based on the WB03A-8684H2V1. The H682-84V1 is an RTOS platform that integrates all Wi-Fi MAC and TCP/IP protocol libraries, and can be used to develop embedded Wi-Fi products that meet your needs.

1.2 Product Features¶

• Built-in low-power 32-bit MCU that can be used as an application processor.
• Supports 120MHz mains frequency
• Operating Voltage: 3V to 3.6V
• Wi-Fi connectivity
  • IEEE 802.11b/g/n
  • Channel 1-14 @ 2.4GHz (CH1-11 for US/CA, CH1-13 for EU/CN, CH1-14 for JP)
  • Supports WEP/WPA/WPA2/WPA2 PSK(AES) and WPA3 security modes.
  • Supports STA/AP/STA+AP operating modes.
  • Supports Bluetooth, SmartConfig, and AP for both mesh methods (both Android and iOS devices).
• PCB on-board antenna
• Operating temperature: -40°C to 105°C
• Bluetooth connectivity
  • Low power consumption Bluetooth BLE5
  • Complete Bluetooth coexistence connector

1.3 Specification¶

1.4 Absolute Electrical Parameters¶

1.5 Normal operating conditions¶

2. Pin Definition¶

2.1 Pin Layout¶

2.2 Pin Descriptions¶

3. Module Size and PCB Package Graphics¶

3.1 Module Size¶

PCB Size ：24±0.3(L)X16±0.3(W)X0.8±0.1(H)

4. Product Packaging Information¶

Pallet + outer box packaging