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WB03A-8684H2V1 Module Specification

1. Product description

1.1 Product description

WB03A-8684H2V1 is a low power consumption embedded (2.4 GHz Wi­Fi) and Bluetooth 5 (LE) IOT dual-mode module. It consists of a highly integrated radio frequency (RF) wireless core, the ESP8684, and the WB03A-8684H2V1. It consists of a highly integrated wireless RF chip, ESP8684, and a small number of peripheral devices, supports STA/AP/STA+AP operation modes, and low-power Bluetooth connectivity at the same time. The WB03A-8684H2V1 includes a 32-bit MCU running at up to 120 MHz, a 1T1R WLAN, 272 KB of SRAM and 2 MB of internal Flash, and a rich set of peripherals. 2MB Flash and rich peripheral resources. The WB03A-8684H2V1 is an RTOS platform with integrated libraries for all Wi-Fi MAC and TCP/IP protocols. Users can develop their own applications based on the WB03A-8684H2V1. The H682-84V1 is an RTOS platform that integrates all Wi-Fi MAC and TCP/IP protocol libraries, and can be used to develop embedded Wi-Fi products that meet your needs.

1.2 Product Features

  • Built-in low-power 32-bit MCU that can be used as an application processor.
  • Supports 120MHz mains frequency
  • Operating Voltage: 3V to 3.6V
  • Wi-Fi connectivity
    • IEEE 802.11b/g/n
    • Channel 1-14 @ 2.4GHz (CH1-11 for US/CA, CH1-13 for EU/CN, CH1-14 for JP)
    • Supports WEP/WPA/WPA2/WPA2 PSK(AES) and WPA3 security modes.
    • Supports STA/AP/STA+AP operating modes.
    • Supports Bluetooth, SmartConfig, and AP for both mesh methods (both Android and iOS devices).
  • PCB on-board antenna
  • Operating temperature: -40°C to 105°C
  • Bluetooth connectivity
    • Low power consumption Bluetooth BLE5
    • Complete Bluetooth coexistence connector

1.3 Specification

Item Description
Product Name WB03A-8684H2V1
Product Description (2.4 GHz Wi­Fi) and Bluetooth 5 (LE) IOT Dual Mode Module
Encapsulation Type SMT Stamp Hole/Pin Hole
Eco-Friendly Note All hardware components are fully compliant with EU RoHS

1.4 Absolute Electrical Parameters

Parameters Description Numerical values Maximum values Units
Tstore Storage Temperature -40 150
VDD33 Supply Voltage -0.3 3.6 V
Static Discharge Voltage (My Body Model) TAMB -25 °C -2 2 KV
Static Discharge Voltage (Machine Models) TAMB -25°C -500 500 V

1.5 Normal operating conditions

Parameters Description Minimum Standard Maximum Units
Ta Operating Temperature -40 - 105
VDD33 Operating Voltage 3 3.3 3.6 V
VOL IO Low Level Output - 0.1×VDD1 - V
VOH IO high level output 0.8×VDD1 - - V
I IO drive current - 40 - mA

2. Pin Definition

2.1 Pin Layout

2.2 Pin Descriptions

Serial No. Name Type Function
1 IO0 I/O/T GPIO0, ADC1_CH0
2 IO1 I/O/T GPIO1, ADC1_CH1
3 EN I High: Disk enable; Low: Disk disable; internal pull-up default.
4 IO2 I/O/T GPIO2, ADC1_CH2, FSPIQ
6 IO5 I/O/T GPIO5, FSPIWP, MTDI, LED PWM
7 IO6 I/O/T GPIO6, FSPICLK, MTCK, LED PWM
8 3V3 P electricity supply
9 NC -- blank pin
10 NC -- blank pin
11 NC -- blank pin
12 IO18 I/O/T GPIO18
5 IO4 I/O/T GPIO4, ADC1_CH4, FSPIHD, MTMS, LED PWM
13 NC -- blank pin
14 NC -- blank pin
15 GND P earth (electric connection)
16 IO7 I/O/T GPIO7, FSPID, MTDO, LED PWM
17 IO8 I/O/T GPIO8
18 IO9 I/O/T GPIO9
19 IO10 I/O/T GPIO10, FSPICS0, LED PWM
20 IO3 I/O/T GPIO3, ADC1_CH3, LED PWM
21 RXD0 I/O/T GPIO19, U0RXD
22 TXD0 I/O/T GPIO20, U0TXD
23 GND P earth (electric connection)

3. Module Size and PCB Package Graphics

3.1 Module Size

PCB Size :24±0.3(L)X16±0.3(W)X0.8±0.1(H)

4. Product Packaging Information

Pallet + outer box packaging